Home
News
About us
Team
Quality Management
REACH, ROHS, Conflict minerals
Company Image
Terms and Conditions
Our Partners
Products
Product Catalog
ED /Roll Copper Foil
Base Material for PCB
Isolated Metal Substrate with Al-Core
Material for the Laminating Process
Auxiliary Material
Cut Parts from PCB´s
Contact
Imprint
Privacy policy
Login
Home
>
Products
>
Materials for lamination process
>
Press Pad
Press Pad
Back
Press Pad
Press Pad 350
Press Pad 500
